bonding pad

См. также в других словарях:

• bonding area — prijungimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. bond pad; bonding area; interconnect pad vok. Bondinsel, f; Bondstelle, f rus. площадка для монтажа, f pranc. plot de soudure, m …   Radioelektronikos terminų žodynas

• Laser bonding — is a marking technique that uses lasers and other forms of radiant energy to bond an additive marking substance to a wide range of substrates. Invented in 1997, this patent protected technology[1] delivers permanent marks on metals, glass and… …   Wikipedia

• bond pad — prijungimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. bond pad; bonding area; interconnect pad vok. Bondinsel, f; Bondstelle, f rus. площадка для монтажа, f pranc. plot de soudure, m …   Radioelektronikos terminų žodynas

• interconnect pad — prijungimo aikštelė statusas T sritis radioelektronika atitikmenys: angl. bond pad; bonding area; interconnect pad vok. Bondinsel, f; Bondstelle, f rus. площадка для монтажа, f pranc. plot de soudure, m …   Radioelektronikos terminų žodynas

• контактная площадка — — [Я.Н.Лугинский, М.С.Фези Жилинская, Ю.С.Кабиров. Англо русский словарь по электротехнике и электроэнергетике, Москва, 1999 г.] Тематики электротехника, основные понятия EN bonding padbossconnection padcontact padinterconnect padterminal… …   Справочник технического переводчика

• Thermal resistance in electronics — Thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. The SI units of thermal resistance are kelvins per watt, or the equivalent… …   Wikipedia

• Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics       Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity.       Computer scientist Manindra Agrawal of the… …   Universalium

• QFN — A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not… …   Wikipedia

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• Glass ionomer cement — A Glass Ionomer Cement (GIC) is one of a class of materials commonly used in dentistry as filling materials and luting cements. These materials are based on the reaction of silicate glass powder and polyalkeonic acid. These tooth coloured… …   Wikipedia

• Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia